Southampton Nanofabrication Centre’s optical lithography facilities use UV mask aligners for pattern resolutions of down to 0.5 µm. We also offer whole/partial mask designing and ordering. The mask aligners operate in contact or proximity modes and can handle a wide range of substrate sizes from 10 × 10 cm up to 200 mm wafers along with the alignment accuracy of 1 nm. The tools possess multiple exposure modes such as proximity, soft, hard and vacuum mode. We have three EVG 620TB and SUSS Microtech alignment systems that have the following capabilities:
- Double-sided mask aligner: capable of aligning both top and bottom side patterns on wafer sizes up to 200 mm.
- The permitted sizes are: 9 inch masks and 200 mm diameter substrates, 7 inch mask and 150 mm substrates, 5 inch mask and 100 mm substrates. The maximum thickness of substrates is 2 mm.
